Heat Sink

• The function of the heat sink is to absorb heat of the semiconductor device and dissipates it to surrounding medium by thermal conductivity. 
• It transfers heat from high temperature to low temperature. The heat sink plays important role for cooling of semiconductor device.

Construction

• The heat sink is made of metal or metal alloy which has high thermal conductivity.
•  It is made of either aluminium or copper. 
• The aluminium is cheaper than copper and heat sink is made by extraction method. 
• The performance of the heat sink is superior if it is made of high thermal conductivity material.  
• The cooling of semiconductor material also depends upon surface area of heat sink and heat transfer cooling co – efficient. 
• The application of heat sink is in the modern integrated circuit, electronic circuit and microprocessor based circuit.

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